2025-09-15
As memory modules are widely used in servers, data centers, and industrial systems, ensuring their long-term reliability under elevated temperature conditions is critical. Traditional full-chamber ovens can be costly, space-consuming, and inefficient when only localized thermal stress is required. To address this challenge, SIREDA developed a custom high-temperature chamber (thermal hood) designed specifically for localized burn-in testing of memory modules.
The customer needed a solution that could:
Sireda designed and manufactured a high-temperature chamber (thermal hood) that directly encloses the memory module area, creating a controlled micro-environment for burn-in testing. The chamber integrates precision heating elements and sensors to maintain accurate temperature levels.
The system is fully integrated with host PC software, allowing operators to program temperature profiles, automate test cycles, and monitor test data in real time. This ensures both consistency and efficiency in the burn-in process.
Through the development of the high-temperature chamber, [Company Name] provided the customer with a cost-effective and efficient tool for memory module burn-in and reliability testing. This case highlights our ability to deliver customized, application-specific test solutions that support customers in meeting their product quality goals.