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High-Temperature Chamber for Memory Module Burn-In
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High-Temperature Chamber for Memory Module Burn-In

2025-09-15

Latest company case about High-Temperature Chamber for Memory Module Burn-In

As memory modules are widely used in servers, data centers, and industrial systems, ensuring their long-term reliability under elevated temperature conditions is critical. Traditional full-chamber ovens can be costly, space-consuming, and inefficient when only localized thermal stress is required. To address this challenge, SIREDA developed a custom high-temperature chamber (thermal hood) designed specifically for localized burn-in testing of memory modules.

The customer needed a solution that could:

  • Provide a localized high-temperature environment for memory modules during burn-in.
  • Operate within a temperature range of room temperature to 85°C.
  • Be controlled remotely and automatically via host PC software.
  • Deliver stable and uniform thermal conditions without affecting surrounding components.


Sireda designed and manufactured a high-temperature chamber (thermal hood) that directly encloses the memory module area, creating a controlled micro-environment for burn-in testing. The chamber integrates precision heating elements and sensors to maintain accurate temperature levels.

The system is fully integrated with host PC software, allowing operators to program temperature profiles, automate test cycles, and monitor test data in real time. This ensures both consistency and efficiency in the burn-in process.

Results & Benefits
  • Controlled Test Environment: Stable and repeatable temperature conditions up to 85°C.
  • Localized Heating: Reduced energy consumption compared to full-size ovens.
  • Automation: Host PC control enables unattended operation and higher throughput.
  • Improved Reliability Testing: Enhanced ability to identify early-life failures and validate product durability.
Conclusion

Through the development of the high-temperature chamber, [Company Name] provided the customer with a cost-effective and efficient tool for memory module burn-in and reliability testing. This case highlights our ability to deliver customized, application-specific test solutions that support customers in meeting their product quality goals.