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Non-Destructive BGA Test Sockets | 25GHz High-Speed & Quick-Swap Design
Self-healing conductive layers maintain stable contact through thermal cycling (-40°C to +125°C)
Tool-Free Maintenance
Modular design enables full contact grid replacement in under 2 minutes
Universal Compatibility
Adaptable for BGA, QFN, CSP, and PoP test sockets (custom configurations available)
Zero Ball Damage
Compression force controlled within 20-25g/ball (vs. 30g+ industry standard)
Property |
Parameter |
Typical Value |
Mechanical |
Insertion Cycles |
≥30K–50K cycles |
|
Contact Force |
15~25g/pin |
|
Operating Temperature |
Commercial -40 ~ +125 |
|
Tolerance |
±0.01mm |
Electrical |
Contact Resistance |
<50mΩ |
|
Impedance |
50Ω (±5%) |
|
Current |
1.5A~3A |
Our elastomeric test sockets offer the perfect balance of performance, durability, and ease of use, ensuring accurate testing while protecting your ICs. Whether you need high-frequency testing for 5G/RF applications, ultra-fine pitch probing, or long-term burn-in reliability, our gentle-contact, low-maintenance design reduces costs and extends the life of your test setup.
✔ No damage to solder balls or pads – Precision force distribution protects your ICs
✔ Long-lasting – 100K+ test cycles with minimal performance degradation
✔ Easy maintenance – Swap contact pins in minutes, no special tools required
✔ High-frequency capable – Reliable signal integrity up to 25GHz
✔ Universal compatibility – Works with BGA, QFN, CSP, PoP & more
Need a custom solution? Contact us today to discuss your IC testing needs—we specialize in bespoke test socket designs for advanced semiconductor applications.