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Heat Dissipation Semiconductor Test Socket Reliable Open Top Type
| MOQ: | 1 |
| Price: | Get Quote |
Detail Information
Place of Origin
China
Brand Name
Sireda
Certification
ISO9001
Model Number
Open Top
Features:
Highly Customizable
Pitch:
≥0.3mm
Pin Count:
2-2000+
Compatible Packages::
BGA, QFN, LGA, SOP, WLCSP
Socket Type:
Open Top
Conductor Type:
Probe Pins, Pogo Pin, PCR
Highlight:
Heat Dissipation Semiconductor Test Socket
,Open Top Semiconductor Test Socket
,Reliable test sockets semiconductors
Product Description
High-Temperature Test Sockets with Superior Heat Dissipation
- Advanced Heat Dissipation
Specially designed for stable operation up to 150 °C+, preventing thermal drift in power device and automotive testing. - Extended Burn-In Durability
Engineered for 200+ hours of continuous validation with minimal contact degradation.
Key Features & Benefits:
- Superior Durability - Built for high-cycle testing with robust materials that withstand thousands of insertions
- Broad Compatibility - Supports BGA, QFN, SOP, and other IC packages
- Precision Contact Technology - Low-resistance spring probes or pogo pins for reliable electrical connections
- Custom Configurations - Tailored test fixtures for unique IC designs and testing requirements
- Thermal & High-Frequency Options - Specialized sockets for burn-in, high-temp, and RF testing
Custom Test Socket: Core Specifications
|
Property |
Parameter |
Typical Value |
|
Mechanical |
Insertion Cycles |
≥30K–50K cycles |
|
|
Contact Force |
20–30g/pin |
|
|
Operating Temperature |
Commercial -40 ~ +125 |
|
|
Tolerance |
±0.01mm |
|
Electrical |
Contact Resistance |
<50mΩ |
|
|
Impedance |
50Ω (±5%) |
|
|
Current |
1.5A~3A |
IC Test Socket Solutions - Precision Testing for Demanding Applications
Whether you're validating prototypes, programming ICs, or running high-volume production tests, our custom test sockets ensure accuracy and repeatability. Engineered for challenging environments, our sockets feature robust mechanical designs to prevent warping under thermal stress while maintaining stable contact resistance. Compatible with automated handlers and testers, they streamline your validation process while cutting downtime.
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