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Open Top Programming IC Test Sockets High Temperature For Semiconductor Testing

Open Top Programming IC Test Sockets High Temperature For Semiconductor Testing

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Detail Information
Place of Origin
China
Brand Name
Sireda
Certification
ISO9001
Model Number
Open Top
Features:
Highly Customizable
Pitch:
≥0.3mm
Pin Count:
2-2000+
Compatible Packages::
BGA, QFN, LGA, SOP, WLCSP
Socket Type:
Open Top
Conductor Type:
Probe Pins, Pogo Pin, PCR
Highlight:

Open Top IC Test Sockets

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Programming IC Test Sockets

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High Temperature semiconductor test socket

Product Description

Premium Open Top Burn-In & Programming Test Socket for Demanding Semiconductor Testing

Designed for reliability in high-temperature environments (up to 130°C+), our burn-in test sockets ensure consistent performance during extended IC programming and testing cycles. Featuring:

  • Customizable configurations to match your specific IC package (BGA, QFN, CSP, etc.)
  • Robust construction for repeated insertions/extractions without wear
  • Optimized for automated test equipment (ATE) integration

Ideal for semiconductor manufacturers, testing labs, and R&D facilities requiring precision and longevity.

Open Top Programming IC Test Sockets High Temperature For Semiconductor Testing

Open Top Programming IC Test Sockets High Temperature For Semiconductor Testing

Below are the essential specifications engineers evaluate when selecting test sockets for maximum reliability and throughput:

Custom Open-Top IC Test Socket: Core Specifications

Property

Parameter

Typical Value

Mechanical

Insertion Cycles

≥30K–50K cycles

 

Contact Force

20–30g/pin

 

Operating Temperature

Commercial -40 ~ +125
Military -55 ~ +130

 

Tolerance

±0.01mm

Electrical

Contact Resistance

<50mΩ

 

Impedance

50Ω (±5%)

 

Current

1.5A~3A

 

Your Trusted Partner for Precision IC Test Socket Solutions

At Sireda, we deliver end-to-end test socket solutions—from high-volume standard models to fully bespoke configurations engineered for your exact requirements.

Standard Solutions Ready for Immediate Deployment:
Fine-Pitch BGA Sockets (0.3mm–1.5mm pitch options)
Low-Profile QFN/LGA Sockets with zero-insertion-force (ZIF) actuation
High-Speed/RF Sockets (DC to 70GHz with minimal signal loss)
Mission-Critical Sockets for burn-in, automotive, and MIL-STD environments

Let’s engineer the optimal interface between your IC and test equipment—contact our team today for a no-obligation project review.