Products
PRODUCTS DETAILS
Home > Products >
Open Top Programming IC Test Sockets High Temperature For Semiconductor Testing

Open Top Programming IC Test Sockets High Temperature For Semiconductor Testing

MOQ: 1
Price: Get Quote
Detail Information
Place of Origin
China
Brand Name
Sireda
Certification
ISO9001
Model Number
Open Top
Features:
Highly Customizable
Pitch:
≥0.3mm
Pin Count:
2-2000+
Compatible Packages::
BGA, QFN, LGA, SOP, WLCSP
Socket Type:
Open Top
Conductor Type:
Probe Pins, Pogo Pin, PCR
Highlight:

Open Top IC Test Sockets

,

Programming IC Test Sockets

,

High Temperature semiconductor test socket

Product Description

Premium Open Top Burn-In & Programming Test Socket for Demanding Semiconductor Testing

Designed for reliability in high-temperature environments (up to 130°C+), our burn-in test sockets ensure consistent performance during extended IC programming and testing cycles. Featuring:

  • Customizable configurations to match your specific IC package (BGA, QFN, CSP, etc.)
  • Robust construction for repeated insertions/extractions without wear
  • Optimized for automated test equipment (ATE) integration

Ideal for semiconductor manufacturers, testing labs, and R&D facilities requiring precision and longevity.

Open Top Programming IC Test Sockets High Temperature For Semiconductor Testing 0

Open Top Programming IC Test Sockets High Temperature For Semiconductor Testing 1

Below are the essential specifications engineers evaluate when selecting test sockets for maximum reliability and throughput:

Custom Open-Top IC Test Socket: Core Specifications

Property

Parameter

Typical Value

Mechanical

Insertion Cycles

≥30K–50K cycles

 

Contact Force

20–30g/pin

 

Operating Temperature

Commercial -40 ~ +125
Military -55 ~ +130

 

Tolerance

±0.01mm

Electrical

Contact Resistance

<50mΩ

 

Impedance

50Ω (±5%)

 

Current

1.5A~3A

 

Your Trusted Partner for Precision IC Test Socket Solutions

At Sireda, we deliver end-to-end test socket solutions—from high-volume standard models to fully bespoke configurations engineered for your exact requirements.

Standard Solutions Ready for Immediate Deployment:
Fine-Pitch BGA Sockets (0.3mm–1.5mm pitch options)
Low-Profile QFN/LGA Sockets with zero-insertion-force (ZIF) actuation
High-Speed/RF Sockets (DC to 70GHz with minimal signal loss)
Mission-Critical Sockets for burn-in, automotive, and MIL-STD environments

Let’s engineer the optimal interface between your IC and test equipment—contact our team today for a no-obligation project review.