Revolutionize Chip Testing with Our New Temperature/Thermal Cycling Workstation

Semiconductor development teams, meet your next-generation testing solution: the Temperature/Thermal Cycling Workstation – a compact, high-speed alternative to bulky environmental chambers, designed specifically for efficient chip verification.

Traditional thermal chambers force engineers to test entire PCBs at industrial temperature ranges (-55°C to 150°C), wasting time and energy cooling/heating non-critical components. Our Targeted Thermal Cycling Workstation changes the game by applying extreme temperatures only to the chip under test (DUT)—accelerating R&D while cutting costs.

• Precision Thermal Stress Only Where You Need It
  • Operates at -55°C to +150°C but only conditions the DUT—not the whole PCB.
  • Eliminates unnecessary thermal cycling of connectors, passives, and support circuitry.
• Blazing-Fast Thermal Ramp Rates
  • 3–5x faster than conventional chambers (active gas thermal transfer ensures rapid stabilization).
  • No frost buildup—dry-air technology prevents condensation, enabling continuous testing.
• Space-Saving & Lab-Friendly
  • Fits on a standard desk—no need for dedicated chamber rooms.
  • Instant setup for on-demand chip-level qualification.

• IC Designers: Verify reliability without waiting for full PCB thermal stabilization.
• Validation Teams: Perform stress tests in hours, not days.
• Startups & Academia: Affordable, benchtop-sized alternative to industrial chambers.

• Temperature Range: -55°C to +150°C
• Ramp Rate: ±30°C/min (adjustable)
• Control: PC programmable via LabVIEW/API
• Footprint: 30cm x 25cm (fits in tight lab spaces)

Stop wasting energy and time on full-board environmental testing. Focus on the chip—not the chamber.