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High Performance BGA Test Socket Custom IC Testing Solutions

High Performance BGA Test Socket Custom IC Testing Solutions

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Detail Information
Place of Origin
China
Brand Name
Sireda
Certification
ISO9001
Model Number
Open Top
Pitch:
≥0.3mm
Pin Count:
2-2000+
Compatible Packages::
BGA, QFN, LGA, SOP, WLCSP
Socket Type:
Open Top
Conductor Type:
Probe Pins, Pogo Pin, PCR
Highlight:

High Performance BGA Test Socket

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High Performance BGA IC socket

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Custom BGA Test Socket

Product Description

BGA Test Sockets - Custom Solutions for IC Testing

  • Wide Pitch Range: 0.3mm to 1.5mm for all BGA package types
  • High & Low Temp Support: -55°C to +140°C (burn-in & validation)
  • Multiple Designs: Open-top, clamshell, ATE, CT;
  • All Testing Needs: Burn-in, functional test, programming
  • Durable: 50,000+ cycles, high reliability

Fast Customization – Tell us your requirements, get a perfect-fit test socket!

 

High Performance BGA Test Socket Custom IC Testing Solutions 0

Custom BGA Test Socket: Core Specifications

Property

Parameter

Typical Value

Mechanical

Insertion Cycles

≥30K–50K cycles

 

Contact Force

20–30g/pin

 

Operating Temperature

Commercial -40 ~ +125
Military -55 ~ +130

 

Tolerance

±0.01mm

Electrical

Contact Resistance

<50mΩ

 

Impedance

50Ω (±5%)

 

Current

1.5A~3A

 

BGA Test Socket Solutions – Precision Testing for Demanding Applications

Whether you're validating prototypes, programming ICs, or running high-volume production tests, our custom BGA test sockets ensure accuracy and repeatability. Engineered for challenging environments, our sockets feature robust mechanical designs to prevent warping under thermal stress while maintaining stable contact resistance. Compatible with automated handlers and testers, they streamline your validation process while cutting downtime.