PRODUCTS DETAILS
Home
>
Products
>
Ultra Compact LPDDR Test Socket For BGA200 Direct Solder Mount Zero Footprint Design
Products
Contact Us
|
Ultra Compact LPDDR Test Socket For BGA200 Direct Solder Mount Zero Footprint Design
| MOQ: | 1 |
| Price: | Get Quote |
Detail Information
Place of Origin
China
Brand Name
Sireda
Certification
ISO9001
Model Number
Open Top
Pitch:
≥0.3mm
Pin Count:
2-2000+
Compatible Packages::
BGA, QFN, LGA, SOP, WLCSP
Socket Type:
Open Top
Conductor Type:
Probe Pins, Pogo Pin, PCR
Highlight:
Ultra Compact LPDDR Test Socket
,LPDDR Test Socket For BGA200
,Ultra Compact bga ic socket
Product Description
Revolutionary Zero-Footprint Test Socket for LPDDR BGA200 Packages
Our ultra-low-profile test socket eliminates traditional testing hassles with its innovative direct-solder design.
Key Benefits:
- No PCB Modifications Needed - Interposer matches exact chip footprint
- Two Testing Options:
- F Series: Simple direct-contact design
- F1 Series: With test points for signal/power analysis
- High-Speed Ready: Optimized for LPDDR4/5 performance validation
- Durable Construction: 10,000+ insertion cycle lifespan
Perfect For:
- Memory manufacturers (production testing)
- Validation labs (quick device verification)
- R&D teams (prototype debugging)
The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details
| Ufs | eMCP | eMMC | DDR | LPDDR | NAND |
| BGA254 | BGA221 | BGA153 | BGA78 | BGA200 | BGA132 |
| BGA153 | BGA162 | BGA96 | BGA315 | BGA136 | |
| BGA169 | BGA152 | ||||
| BGA100 | BGA154 | ||||
| BGA254 |
F VS F1 Solution
How to: install the adapter ↔ test board.
Step 1.
Solder interposer -> test board
Step 2.
Attach test socket
Step 3.
Insert chip & lock cover
Recommended Products
