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High Density EMCP Test Socket For BGA221 Packages Zero Footprint
| MOQ: | 1 |
| Price: | Get Quote |
Detail Information
Place of Origin
China
Brand Name
Sireda
Certification
ISO9001
Model Number
Open Top
Pitch:
≥0.3mm
Pin Count:
2-2000+
Compatible Packages::
BGA, QFN, LGA, SOP, WLCSP
Socket Type:
Open Top
Conductor Type:
Probe Pins, Pogo Pin, PCR
Highlight:
BGA221 EMCP Test Socket
,High Density EMCP Test Socket
,EMCP Test Socket Zero Footprint
Product Description
High-Density eMCP Testing Solution for BGA221 Packages
Revolutionize your embedded memory validation with our zero-footprint BGA221 eMCP test socket. The precision-engineered interposer matches the exact chip footprint, enabling direct solder mounting without PCB modifications.
Key Advantages:
- Instant deployment with no PCB milling requirements
- Two configurations available:
- F-Series: Standard contact solution
- F1-Series: Integrated test points for signal analysis
- Supports LPDDR+NAND stacked packages
- Gold-plated contacts ensure > 10,000 test cycles
- Compact 2.5mm profile ideal for dense boards
Technical Specs:
✔ BGA221 compatibility (0.5mm pitch)
✔ Supports JEDEC eMCP standards
✔ Operating temp: -40°C to +125°C
✔ Signal integrity up to 4266Mbps
Perfect for:
Memory manufacturers, smartphone repair centers, embedded system developers
The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details
| Ufs | eMCP | eMMC | DDR | LPDDR | NAND |
| BGA254 | BGA221 | BGA153 | BGA78 | BGA200 | BGA132 |
| BGA153 | BGA162 | BGA96 | BGA315 | BGA136 | |
| BGA169 | BGA152 | ||||
| BGA100 | BGA154 | ||||
| BGA254 |
F vs F1 Solution Comparison
Installation Steps:
Solder interposer -> test board
Attach test socket
Insert chip & lock cover
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