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Zero Footprint EMMC Test Socket Direct Solder BGA162/BGA169/BGA254 BGA Test Socket
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Zero Footprint EMMC Test Socket Direct Solder BGA162/BGA169/BGA254 BGA Test Socket
| MOQ: | 1 |
| Price: | Get Quote |
Detail Information
Place of Origin
China
Brand Name
Sireda
Certification
ISO9001
Model Number
Open Top
Pitch:
≥0.3mm
Pin Count:
2-2000+
Compatible Packages::
BGA, QFN, LGA, SOP, WLCSP
Socket Type:
Open Top
Conductor Type:
Probe Pins, Pogo Pin, PCR
Highlight:
BGA162 EMMC Test Socket
,BGA169 EMMC Test Socket
,BGA254 Test Socket
Product Description
High-Performance Zero-Footprint eMMC Test Sockets for BGA162, BGA169 & BGA254 Packages
Our innovative direct-solder test sockets revolutionize eMMC memory validation with their ultra-compact, chip-size interposer design. Eliminating the need for PCB modifications, these sockets save valuable development time while ensuring superior signal integrity
Key Features & Benefits:
- Perfect chip-sized interposer matches exact BAG153/BGA100/BGA162/BGA169/BGA254 footprints
- No PCB cutouts required - simpler board layout design
- Direct solder mounting for instant testing capability
Flexible Testing Options
- Standard F Series: Simple, reliable contact solution
- Advanced F1 Series:
- Integrated test points for signal monitoring
- Power consumption analysis capabilities
- Debugging-friendly architecture
Engineering-Grade Reliability
- 10,000+ insertion cycles - exceeds industry standards
- -40 °C to +125°C operating range
- Gold-plated contacts for superior conductivity
The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details
| Ufs | eMCP | eMMC | DDR | LPDDR | NAND |
| BGA254 | BGA221 | BGA153 | BGA78 | BGA200 | BGA132 |
| BGA153 | BGA162 | BGA96 | BGA315 | BGA136 | |
| BGA169 | BGA152 | ||||
| BGA100 | BGA154 | ||||
| BGA254 |
F vs F1 Solution Comparison
Installation Steps:
- Solder interposer -> test board
- Attach test socket
- Insert chip & lock cover
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