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Compact Benchtop Thermal Test System -55°C To 150°C For Fast Chip Testing

Compact Benchtop Thermal Test System -55°C To 150°C For Fast Chip Testing

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Detail Information
Place of Origin
China
Brand Name
Sireda
Certification
ISO9001
Model Number
Burn-In Test Chamber
Customizable For:
DDR3, DDR4, DDR5
Maximum Operating Temperature:
125°C
Highlight:

Benchtop Thermal Test System

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Chip Testing Thermal Test System

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Compact thermal test machine

Product Description
Benchtop Thermal Test System (-55°C to 150°C)
Fast, Precise Temperature Cycling for IC Development and Quality Control

Our benchtop thermal test system delivers rapid temperature transitions from -55°C to +150°C, achieving -40°C in just 7 minutes - perfect for accelerated life testing and failure analysis. The localized temperature control technology minimizes thermal mass impact while providing precise chip-level temperature forcing. This compact solution significantly reduces development time and testing costs compared to full-chamber systems, making it ideal for engineering labs performing:

  • Reliability qualification testing
  • Temperature-dependent parameter characterization
  • Failure mode analysis
  • Production sample verification

Technical Highlights:

  • Ultra-fast cooling capability (7min to -40°C)
  • Precise chip-scale temperature control
  • Compact benchtop footprint (saves lab space)
  • Lower operating costs than environmental chambers
  • Simple integration with test handlers/probers

The image below shows the equipment with its main components.

Model 708-0000051
Dimensions 420x460x630mm
Temperature Range -55°C~150°C
Temperature change rate 25°C to 40°C<7Min
Temperature control accuracy ±1°C
Display accuracy ±0.1°C
Communication interface RS232
Service life 2000H