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4 Wire Precision Kelvin Test Socket For Low Resistance Testing Customizable

4 Wire Precision Kelvin Test Socket For Low Resistance Testing Customizable

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Detail Information
Place of Origin
China
Brand Name
Sireda
Certification
ISO9001
Model Number
Open Top
Features:
Highly Customizable
Pitch:
≥0.3mm
Pin Count:
2-2000+
Compatible Packages::
BGA, QFN, LGA, SOP, WLCSP
Socket Type:
Open Top
Conductor Type:
Probe Pins, Pogo Pin, PCR
Highlight:

Customizable Kelvin Test Socket

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4 Wire Kelvin Test Socket

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Low Resistance Kelvin Testing Socket

Product Description

Kelvin Four-Wire Testing (4-Wire Kelvin Method)

Also known as 4-Terminal (4T) Testing, 4-Wire Testing, or 4-Point Probe Method, this is an impedance measurement technique that uses separate pairs of current-carrying and voltage-sensing electrodes. Compared to traditional two-terminal (2T) sensing, Kelvin testing allows for significantly more accurate measurements by eliminating lead and contact resistance errors.

Currently, this method is primarily used for circuit testing in SOP (Small Outline Package) devices, ensuring high precision in resistance measurements for semiconductor validation, quality control, and R&D applications.

4 Wire Precision Kelvin Test Socket For Low Resistance Testing Customizable 0 4 Wire Precision Kelvin Test Socket For Low Resistance Testing Customizable 1 4 Wire Precision Kelvin Test Socket For Low Resistance Testing Customizable 2

Kelvin Test Socket

 

 

4 Wire Precision Kelvin Test Socket For Low Resistance Testing Customizable 3       4 Wire Precision Kelvin Test Socket For Low Resistance Testing Customizable 4

 Adapter Module (Buttom)                                  Adapter Module(Top)

 

Why Choose Our Kelvin Test Sockets?

1. Unmatched Precision for Demanding Measurements

Our Kelvin test sockets leverage true 4-wire (4-point probe) technology, eliminating lead resistance errors for high-accuracy impedance measurements—critical for SOP, QFN, BGA, and advanced IC packages.

2. Engineered for Reliability & Repeatability

  • Gold-plated spring probes ensure <10mΩ contact resistance and long-lasting performance.
  • Self-cleaning contacts reduce maintenance downtime in high-volume production testing.

3. Customizable Solutions for Your Needs

  • Optimized for your specific package type (SOP-8 to BGA-256+) and frequency range (DC to 6GHz+).
  • Modular designs support quick conversion between different DUT interfaces.

4. Speed Up Your Testing Workflow

  • Low-insertion-force (LIF) design prevents device damage during placement.
  • Compatible with automated handlers for high-throughput production environments.