
Launches Advanced HAST Test Socket for Semiconductor Reliability Testing
2025-09-15
.gtr-container-xyz789 {
font-family: Verdana, Helvetica, "Times New Roman", Arial, sans-serif;
color: #333;
line-height: 1.6;
padding: 15px;
box-sizing: border-box;
max-width: 100%;
overflow-x: hidden;
}
.gtr-container-xyz789 p {
font-size: 14px;
margin-bottom: 1em;
text-align: left;
color: #444;
}
.gtr-container-xyz789 strong {
font-weight: bold;
color: #222;
}
.gtr-container-xyz789 em {
font-style: italic;
color: #555;
}
.gtr-container-xyz789 .gtr-title {
font-size: 18px;
font-weight: bold;
margin-bottom: 1.5em;
color: #0056b3; /* A strong blue for industrial feel */
text-align: left;
}
.gtr-container-xyz789 .gtr-section-heading {
font-size: 16px;
font-weight: bold;
margin-top: 2em;
margin-bottom: 1em;
color: #0056b3;
text-align: left;
}
.gtr-container-xyz789 ul {
list-style: none !important;
margin: 0 !important;
padding: 0 !important;
margin-bottom: 1em !important;
}
.gtr-container-xyz789 ul li {
position: relative;
padding-left: 25px;
margin-bottom: 0.5em;
font-size: 14px;
text-align: left;
color: #444;
}
.gtr-container-xyz789 ul li::before {
content: "•"; /* Custom bullet point */
position: absolute;
left: 0;
top: 0;
color: #0056b3; /* Blue bullet */
font-size: 1.2em;
line-height: inherit;
}
.gtr-container-xyz789 a {
color: #007bff;
text-decoration: none;
}
.gtr-container-xyz789 a:hover {
text-decoration: underline;
}
@media (min-width: 768px) {
.gtr-container-xyz789 {
padding: 25px;
max-width: 800px; /* Constrain width for better readability on large screens */
margin: 0 auto; /* Center the component */
}
.gtr-container-xyz789 .gtr-title {
font-size: 22px;
}
.gtr-container-xyz789 .gtr-section-heading {
font-size: 18px;
}
}
Launches Advanced HAST Test Socket for Semiconductor Reliability Testing
SHENZHEN,September 15th, [Sireda Technology Co., Ltd.] a leading provider of semiconductor test solutions, today announced the launch of its newly developed HAST (Highly Accelerated Stress Test) socket, designed to meet the demanding requirements of modern reliability testing for integrated circuits.
The new HAST test socket is engineered to perform under extreme environmental stress conditions, enabling customers to accelerate device qualification and reliability verification. Specifically, it supports testing at 130°C, 85% relative humidity (RH), and under pressurized environments (typically 2.3 atm) for extended durations ranging from 96 to 168 hours.
This capability allows semiconductor manufacturers and research institutions to evaluate product durability and ensure compliance with industry standards for high-reliability applications, including automotive, aerospace, and industrial electronics.
"As devices continue to shrink in size while expanding in functionality, ensuring long-term reliability is more critical than ever," said [Executive Name], [Title] at [Company Name]. "Our HAST test socket delivers the stability, precision, and repeatability required for rigorous stress testing, helping customers shorten time-to-market while maintaining product integrity."
Key benefits of the HAST test socket include:
High-temperature and high-humidity endurance.
Secure and stable contact performance under pressurized conditions.
Compatibility with extended test durations (96–168 hours).
Scalable design adaptable to various package types.
With this launch, Sireda continues to strengthen its position as an innovator in semiconductor testing solutions, addressing the increasing demand for reliability validation in advanced electronics.
For more information about the HAST test socket and other semiconductor test solutions, please visit www.sireda.com .
View More

Revolutionize Chip Testing with Our New Temperature/Thermal Cycling Workstation
2025-09-01
.gtr-container-abc987 {
font-family: Verdana, Helvetica, "Times New Roman", Arial, sans-serif;
color: #333;
line-height: 1.6;
max-width: 800px;
margin: 0 auto;
padding: 20px;
box-sizing: border-box;
}
.gtr-container-abc987 .gtr-title-main {
font-size: 18px;
font-weight: bold;
margin-bottom: 1em;
text-align: left;
color: #0056b3;
}
.gtr-container-abc987 .gtr-title-section {
font-size: 16px;
font-weight: bold;
margin-top: 1.5em;
margin-bottom: 1em;
text-align: left;
color: #0056b3;
border-bottom: 1px solid #eee;
padding-bottom: 5px;
}
.gtr-container-abc987 p {
font-size: 14px;
margin: 1em 0;
text-align: left;
word-break: normal;
overflow-wrap: normal;
}
.gtr-container-abc987 strong {
font-weight: bold;
}
.gtr-container-abc987 em {
font-style: italic;
}
.gtr-container-abc987 ul {
list-style: none !important;
margin: 1em 0 !important;
padding: 0 !important;
}
.gtr-container-abc987 ul li {
position: relative;
padding-left: 25px;
margin-bottom: 0.5em;
font-size: 14px;
text-align: left;
}
.gtr-container-abc987 ul.gtr-list-checkmark li::before {
content: '✓';
position: absolute;
left: 0;
top: 0;
color: #28a745;
font-weight: bold;
font-size: 16px;
line-height: 1.6;
}
.gtr-container-abc987 ul:not(.gtr-list-checkmark) li::before {
content: '•';
position: absolute;
left: 0;
top: 0;
color: #0056b3;
font-weight: bold;
font-size: 16px;
line-height: 1.6;
}
.gtr-container-abc987 img {
max-width: 100%;
height: auto;
display: block;
margin: 1em auto;
}
@media (min-width: 768px) {
.gtr-container-abc987 {
padding: 30px;
}
.gtr-container-abc987 .gtr-title-main {
font-size: 22px;
margin-bottom: 1.5em;
}
.gtr-container-abc987 .gtr-title-section {
font-size: 18px;
margin-top: 2em;
margin-bottom: 1.2em;
}
}
Revolutionize Chip Testing with Our New Temperature/Thermal Cycling Workstation
Semiconductor development teams, meet your next-generation testing solution: the Temperature/Thermal Cycling Workstation – a compact, high-speed alternative to bulky environmental chambers, designed specifically for efficient chip verification.
Why Settle for Slow, Inefficient Testing?
Traditional thermal chambers force engineers to test entire PCBs at industrial temperature ranges (-55°C to 150°C), wasting time and energy cooling/heating non-critical components. Our Targeted Thermal Cycling Workstation changes the game by applying extreme temperatures only to the chip under test (DUT)—accelerating R&D while cutting costs.
Key Advantages Over Standard Chambers
Precision Thermal Stress Only Where You Need It
Operates at -55°C to +150°C but only conditions the DUT—not the whole PCB.
Eliminates unnecessary thermal cycling of connectors, passives, and support circuitry.
Blazing-Fast Thermal Ramp Rates
3–5x faster than conventional chambers (active gas thermal transfer ensures rapid stabilization).
No frost buildup—dry-air technology prevents condensation, enabling continuous testing.
Space-Saving & Lab-Friendly
Fits on a standard desk—no need for dedicated chamber rooms.
Instant setup for on-demand chip-level qualification.
Who Benefits?
IC Designers: Verify reliability without waiting for full PCB thermal stabilization.
Validation Teams: Perform stress tests in hours, not days.
Startups & Academia: Affordable, benchtop-sized alternative to industrial chambers.
Technical Highlights:
Temperature Range: -55°C to +150°C
Ramp Rate: ±30°C/min (adjustable)
Control: PC programmable via LabVIEW/API
Footprint: 30cm x 25cm (fits in tight lab spaces)
Cut Development Time & Costs Today
Stop wasting energy and time on full-board environmental testing. Focus on the chip—not the chamber.
View More